News Snippets

The paper "Junction-level Thermal Extraction and Simulation of 3DICs" won the Best Student Paper Award at IEEE 3DIC 2009.
- The paper was presented by Samson Melamed, NCSU, 30 Sep. 2009

The paper "Using Thermal Analysis as a Tool to Aid Analog Floorplanning" won the People's Choice Award for "Track 9: Special Interest" at CDNLive! Silicon Valley 2007.
- by David Schwan, RF Micro Devices (formerly Sirenza), 11 Sep. 2007

"We see more thermal variation at 45 nm ... each portion of the chip can operate at a different temperature rather than having a uniform temperature as is modeled today."
- Cadence's Vassilios Gerousis, interviewed on cdnusers.org, 10 Sep. 2007