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Computes full-chip, three-dimensional temperature profile at device- and interconnect-level resolution.

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“Gradient is helping AMD achieve closure on interconnect electromigration verification and device reliability taking into account actual hot spot temperature and reduce unnecessary conservatism in designs. We’re able to achieve thermal modeling resolution down to a single via which significantly enhances our electromigration avoidance capability.”

— Yuri Apanovich, Electrical Analysis Manager, Advanced Micro Devices

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Agilent Webinar Feb 6, 2014: How to Improve PA Performance & Reliability using Electro-Thermal Analysis WIN Semiconductors Becomes First GaAs Foundry to Unveil Support for Electro-Thermal Analysis in ADS Agilent Technologies Announces Expanded Business Relationship with Gradient Design Automation Design Automation Conference 2013, Austin, Texas, June 3-5: Please visit Gradient at Booth 1633 Agilent ships ADS 2012: New electro-thermal simulator that incorporates dynamic temperature effects Agilent Webinar Oct 2012: Integrated Electro-Thermal Solution Delivers Thermally Aware Circuit Simulation Electro-thermal simulation is a key new ADS 2012 feature among those highlighted by Agilent at IMS 2012 Agilent announces ADS 2012, including a new ADS electro-thermal simulator, based on a 3-D thermal solver natively integrated into ADS DAC 2012 User Track paper: Hierarchical Thermal and Electromigration Analysis for Cell-based Designs SEMI-THERM 2012 paper: Robustness Optimization of Power MOSFETs under Inductive Breakdown FutureFab July 2011: Thermal Design Issues -- Impacting Design to Packaging, pages 43-48 (6.65MB) IEEE Micro May/June 2011: Temperature-Aware Architecture: Lessons and Opportunities ISQED 2011 paper: Switching Constraint-driven Thermal and Reliability Analysis of Nanometer Designs EPEPS 2010 paper: Thermal-Aware Reliability Analysis of Nanometer Designs THERMINIC 2010 paper: Electro-thermal modeling of multi-trenched MOS power transistors THERMINIC 2010 paper: Improve Thermal Profile of Memory-on-Logic 3DICs by Tier-swapping DAC User Track 2010 paper: A Practical Approach to Thermal Modeling and Validation of 3D ICs EuroSimE 2010 paper: Electro-thermal modeling/characterization of large lateral PNP drivers