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// Put new news items below here

idx = idx + 1;
newsDate[idx] = "10/7/2009";
newsMag[idx] = "THERMINIC Workshop in Leuven, Belgium";
newsMagLogoTag[idx] = "<img src='../img/THERMINIC_logo.gif' width='193' height='60' border='0' alt='15th International Workshop on Thermal investigations of ICs and Systems (THERMINIC)'>";
newsMagLogoLink[idx] = "http://cmp.imag.fr/conferences/therminic/therminic2009/";
newsTitle[idx] = "Fine Grain Thermal Modeling of 3D Stacked Structures";
newsUrl[idx] = "http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5340064&isnumber=5340033";
newsSynopsis[idx] = "Joint paper with IMEC at THERMINIC 2009";

idx = idx + 1;
newsDate[idx] = "9/28/2009";
newsMag[idx] = "IEEE International 3D Systems Integration Conference (3DIC)";
newsMagLogoTag[idx] = "<img src='../img/3DIC_Logo_180x86.png' width='180' height='86' border='0' alt='IEEE International 3D Systems Integration Conference (3DIC)'>";
newsMagLogoLink[idx] = "http://www.3dic-conf.org/";
newsTitle[idx] = "Junction-level Thermal Extraction and Simulation of 3DICs";
newsUrl[idx] = "http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5306529&isnumber=5306519";
newsSynopsis[idx] = "Joint paper with North Carolina State University at IEEE 3DIC 2009";

idx = idx + 1;
newsDate[idx] = "10/22/2008";
newsMag[idx] = "Sematech Workshop on Design and Test Challenges for 3D ICs";
newsMagLogoTag[idx] = "<img src='../img/Sematech_Logo_168x85.jpg' width='168' height='85' border='0' alt='Sematech Workshop on Design and Test Challenges for 3D ICs'>";
newsMagLogoLink[idx] = "http://www.sematech.org/meetings/announcements/8518/program.htm";
newsTitle[idx] = "SEMATECH Announces Speaker Line-up for 3D IC Design and Test Workshop";
newsUrl[idx] = "http://www.sematech.org/corporate/news/releases/20081022.htm";
newsSynopsis[idx] = "Design and test experts to focus on near- and long-term challenges and assess the state of the industry";

idx = idx + 1;
newsDate[idx] = "9/26/2008";
newsMag[idx] = "THERMINIC Workshop in Rome, Italy";
newsMagLogoTag[idx] = "<img src='../img/THERMINIC_logo.gif' width='193' height='60' border='0' alt='14th International Workshop on Thermal Investigations of ICs and Systems'>";
newsMagLogoLink[idx] = "http://cmp.imag.fr/conferences/therminic/therminic08/index.php";
newsTitle[idx] = "Practical Chip-Centric Electro-Thermal Simulations";
newsUrl[idx] = "http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=4669912&isnumber=4669861";
newsSynopsis[idx] = "Full-chip dynamic electro-thermal simulation is achieved by coupling a circuit simulator and a thermal solver, through a collaboration of ON Semiconductor, IMEC and Gradient";

idx = idx + 1;
newsDate[idx] = "12/5/2007";
newsMag[idx] = "cdnusers.org";
newsMagLogoTag[idx] = "<img src='../img/cdnusers_logo 188x63.gif' width='188' height='63' border='0' alt='Cadence Designer Network'>";
newsMagLogoLink[idx] = "http://www.cdnusers.org";
newsTitle[idx] = "Using Thermal Analysis as a Tool to Aid Analog Floorplanning";
newsUrl[idx] = "http://www.cadence.com/rl/Resources/conference_papers/vtp_cdnlivesv2007_schwan.pdf";
newsSynopsis[idx] = "People's Choice Award for Custom IC at CDNLive! Silicon Valley 2007 shows how CircuitFire, a transistor-level thermal simulator, operates within the Virtuoso environment, by D. Schwan, RFMD";

idx = idx + 1;
newsDate[idx] = "6/28/2007";
newsMag[idx] = "ESNUG";
newsMagLogoTag[idx] = "<img src='../img/DeepChip_logo_189x52.JPG' width='189' height='52' border='0' alt='ESNUG - DeepChip'>";
newsMagLogoLink[idx] = "http://www.deepchip.com";
newsTitle[idx] = "One user's eval of the Gradient CircuitFire tool";
newsUrl[idx] = "http://www.deepchip.com/items/0465-12.html";
newsSynopsis[idx] = "Morgan Ercanbrack of AMI Semiconductor details the use of CircuitFire to debug a real design. Plus an accuracy recap from 2006";

idx = idx + 1;
newsDate[idx] = "6/1/2007";
newsMag[idx] = "Semiconductor International";
newsMagLogoTag[idx] = "<img src='../img/semicond_intl_logo_188x70.png' width='188' height='70' border='0' alt='Semiconductor International'>";
newsMagLogoLink[idx] = "http://www.semiconductor.net/";
newsTitle[idx] = "New Standards, Techniques for Package Thermal Modeling";
newsUrl[idx] = "http://www.semiconductor.net/article/CA6445467.html";
newsSynopsis[idx] = "Gradient teams up with Flomerics to develop IC and package thermal co-simulation";

idx = idx + 1;
newsDate[idx] = "4/28/2006";
newsMag[idx] = "ESNUG";
newsMagLogoTag[idx] = "<img src='../img/DeepChip_logo_189x52.JPG' width='189' height='52' border='0' alt='ESNUG - DeepChip'>";
newsMagLogoLink[idx] = "http://www.deepchip.com";
newsTitle[idx] = "Gradient FireBolt's temperatures correlate well with test chip";
newsUrl[idx] = "http://www.deepchip.com/items/0454-12.html";
newsSynopsis[idx] = "Product review from an anonymous user, providing a good indication of accuracy";

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